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M.2 NVMe SSD

Key features
  • 3D MLC ( Multi-Level Cell ) NAND Flash memory
  • PCIe Gen3 8Gb/s Interface, x4 Lanes
  • Maximum performance : Sequential Read up to 2,540 MB/s Sequential Write up to 1,100 MB/s
  • LDPC (Low-Density Parity Check) & RAID engine for advance error correction External DRAM for efficient cache data processing
  • Dynamic Thermal throttling
  • Supports TRIM command ( Windows 7 and up )

The M.2 2280 NVMe SSD via PCIe Gen3x4 interface is specifically designed for niche applications for server / networking, data center, thin client and mission critical industrial alike applications.

By adopting NVMe 1.2 specifications and integrating 3D NAND MLC technology, ATP’s M.2 2280 NVMe SSD is constructed via a PCIe Gen 3x4 interface offering up to 1TB of memory capacity and boosted performance that exceed the previous bottleneck of AHCI standards, delivering Sequential Read 2,540 MB/s and Sequential Write 1,100 MB/s.

ATP's Next Generation Form Factor ( NGFF ) SSD with NVMe protocol and PCIe interface, delivers up to 1 TB in memory capacity and unprecedented read / write speed up to 4x ~ 6x the SATA interface bandwidth; this setup maximizes the capability of high-speed PCI Express storage devices to perform multiple I/O (in/out) operations in parallel to fulfill the demanding responsiveness for all high-end enterprise storage systems.

SSD are not created equal, while the market strives for performance in NVMe SSDs, ATP takes a step further instead in carefully considering aspects of enhancing memory longevity and reliability for mission critical environments. This includes careful selection of BOM planning with key suppliers, and adding wide temperature and extreme power cycling testing.

Heat dissipation is one major issue commonly encountered for NVMe. Through temperature feedback and optimized thermal throttling mechanism, ATP’s NVMe may avoid drastic performance drop or possible damage to controller caused by overheating.

ATP's NVMe based M.2 2280 SSD provides performance specifically tailored for an array of applications such as server/networking, data center, thin client, mission critical and industrial applications.

 

 

Product Name

M.2 NVMe

2280-D2-M

Product Line

Superior

Naming

N600i

N600c

Flash Type

iTemp MLC

MLC

Density

128 GB to 1 TB

Performance

Sequential Read up to (MB/s)

2,540

Sequential Write up to (MB/s)

1,100

Random Read IOPS (4K, QD32)  

Up to 100,000

Interface

PCIe Gen3 Interface, x4 Lanes

Operating Temperature

-40°C to 85°C

0°C to 70°C

Reliability

TBW* (max.)

1,280 TB

1,536 TB

DWPD* (max.)

1.75

2.10

MTBF @ 25°C

>2,000,000 hours

Dimensions: L x W x H (mm)

80.0 x 22.0 x 3.5

* Under highest Sequential write value. May vary by density, configuration and applications

 

Full Features:

• Capacity 128 GB / 256 GB / 512 GB / 1 TB
• 3D MLC ( Multi-Level Cell ) NAND Flash memory
• Operating temperature 0°C to 70°C / -40°C to 85°C
• PCIe Gen3 Interface, x4 Lanes
• Maximum performance: Sequential Read up to 2,540 MB/s
• Sequential Write up to 1,100MB/s
• Compliant with PCI Express Base Specification Rev.3.1
• Compliant with NVMe Express Base Specification Rev.1.2
• Compliant with PCIe M.2 Specification v1.0
• 2280-D2-M form factor
• LDPC (Low-Density Parity Check) & RAID engine for advanced error correction
• External DRAM for efficient cache data processing
• Dynamic Thermal throttling
• Supports TRIM command( Windows 7 and up)
• Enhanced endurance by Global wear leveling
• RoHS Compliant and CE/FCC Certification

Applications:

• Networking
• Thin Clients
• Enterprise Storage Systems

 


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