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News Release

  • 2017-11-02 ATP Releases DDR4-2666 for the latest Intel® Xeon® Scalable and 8th Gen Intel® Core™ Processors
    ATP’s latest DDR4 solutions are ideal for high-performance computing (HPC) applications requiring high density, low power, great scalability and efficiency, such as telecommunication infrastructures, networking storage systems, network-attached storage (NAS) servers, micro/cloud servers, and embedded systems like industrial PCs.
  • 2017-10-25 ATP Unveils Leading-Edge Solutions at Embedded Technology 2017
    ATP showcases its expanded portfolio of next-generation, feature-rich storage and memory solutions at the Embedded Technology and IoT Conference and Exhibition 2017 in Pacifico Yokohama from November 15 to 17.
  • 2017-08-28 ATP Debuts 1 TB SSD for rugged and industrial environments
    ATP debuts its first NVMe based M.2 2280 SSD offering twice the performance of SATA-based SSDs.
  • 2017-07-31 ATP Introduces Configurable Embedded SSDs at 2017 FMS Event
    ATP introduces Dynamic Overprovisioning (OP) and Mid-Density configurable SSD that offers end users the flexibility to tailor-made Embedded SSDs @ 2017 Flash Memory Summit
  • 2017-07-12 How to choose the right SD card for your application
    Before storing data on a memory card, however, it is important to understand how your intended use, or application, correlates to the various SD memory card symbols, and how those symbols represent SD specifications. Here are the five important traits users need to know about SD memory cards.
  • 2017-03-07 ATP Reveals 3D NAND SSD product line at Embedded World 2017
    ATP reveals its new 3D NAND based SATA product line up on the Embedded World 2017
  • 2016-11-16 ATP at Full Steam for Embedded Technology 2016
    Taipei, Taiwan (November 16, 2016) – ATP Electronics Inc., the leading manufacturer of embedded Flash and ruggedized SSD and DRAM modules, displays a complete product line of its next generation storage solutions designed, manufactured, and tested from NAND wafer to finished SSD. New product line displays include new industrial temperature MLC and SLC memory cards, and embedded SSDs utilizing 3D NAND flash. ATP will showcase these new solutions and related products from Nov 16th to 18th at Embedded Technology 2016 in Yokohama, Japan. ATP booth will be located at # C-30-3.
  • 2016-11-08 ATP at Full Steam for Electronica 2016
    Taipei, Taiwan (November 8, 2016) – ATP Electronics Inc., the leading manufacturer of embedded Flash and ruggedized SSD and DRAM modules, displays a complete product line of its next generation storage solutions designed, manufactured, and tested from NAND wafer to finished SSD. New product line displays include new industrial temperature MLC and SLC memory cards, and embedded SSDs utilizing 3D NAND flash. ATP will showcase these new solutions and related products at Electronica 2016 from November 8th to 11th, which takes place at the Messe München International Center Germany. ATP will be located at Hall A6, Booth # 459.
  • 2016-10-17 ATP Introduces Industry’s First DDR3L-1866 ECC SODIMM
    Well-suited for Intel Apollo Lake based IoT and embedded platforms, ATP's industry’s first DDR3L ECC SODIMM technology is capable of operating at 1866MHz.
  • 2016-09-12 DDR4 ECC Mini-UDIMM, Now Joining ATP Mini DIMM Product Line
    The new DDR4 ECC VLP Mini-UDIMM is suited for high-performance applications requiring high density and better power efficiency consumption management, such application includes: Telecommunication infrastructure, networking systems, Micro/Cloud servers and Industrial PCs.
  • 2016-08-08 ATP Readies 3D NAND SSDs For Embedded Applications
    Taipei, Taiwan (August 8, 2016) – ATP Electronics Inc., the leading manufacturer of embedded Flash and ruggedized SSD and DRAM modules, announces its next generation of storage solutions utilizing the latest 3D NAND flash technologies. Combined with ATP’s wafer packaging and testing capabilities, these new lines of 3D NAND based SSDs including M.2, mSata, SlimSata, 2.5” SSD, eUSB and memory cards, provides a new level of product differentiation targeting the industrial and embedded markets. ATP will showcase these new solutions and related products at the Flash Memory Summit 2016 from August 9 to 11, at the Santa Clara Convention Center, meeting room #205.
  • 2016-03-28 ATP Furthers Support of Micron Legacy DRAM Modules
    Continues to manufacture SDR/DDR1 Modules on Micron EOL List
  • 2016-02-15 ATP highlights Its Automotive Solutions at the EW2016
    In addition to introducing latest SATA III Product Family
  • 2016-11-16 ATP at Full Steam for Embedded Technology 2016
    Taipei, Taiwan (November 16, 2016) – ATP Electronics Inc., the leading manufacturer of embedded Flash and ruggedized SSD and DRAM modules, displays a complete product line of its next generation storage solutions designed, manufactured, and tested from NAND wafer to finished SSD. New product line displays include new industrial temperature MLC and SLC memory cards, and embedded SSDs utilizing 3D NAND flash. ATP will showcase these new solutions and related products from Nov 16th to 18th at Embedded Technology 2016 in Yokohama, Japan. ATP booth will be located at # C-30-3.
  • 2016-11-08 ATP at Full Steam for Electronica 2016
    Taipei, Taiwan (November 8, 2016) – ATP Electronics Inc., the leading manufacturer of embedded Flash and ruggedized SSD and DRAM modules, displays a complete product line of its next generation storage solutions designed, manufactured, and tested from NAND wafer to finished SSD. New product line displays include new industrial temperature MLC and SLC memory cards, and embedded SSDs utilizing 3D NAND flash. ATP will showcase these new solutions and related products at Electronica 2016 from November 8th to 11th, which takes place at the Messe München International Center Germany. ATP will be located at Hall A6, Booth # 459.
  • 2016-10-17 ATP Introduces Industry’s First DDR3L-1866 ECC SODIMM
    Well-suited for Intel Apollo Lake based IoT and embedded platforms, ATP's industry’s first DDR3L ECC SODIMM technology is capable of operating at 1866MHz.
  • 2016-09-12 DDR4 ECC Mini-UDIMM, Now Joining ATP Mini DIMM Product Line
    The new DDR4 ECC VLP Mini-UDIMM is suited for high-performance applications requiring high density and better power efficiency consumption management, such application includes: Telecommunication infrastructure, networking systems, Micro/Cloud servers and Industrial PCs.
  • 2016-08-08 ATP Readies 3D NAND SSDs For Embedded Applications
    Taipei, Taiwan (August 8, 2016) – ATP Electronics Inc., the leading manufacturer of embedded Flash and ruggedized SSD and DRAM modules, announces its next generation of storage solutions utilizing the latest 3D NAND flash technologies. Combined with ATP’s wafer packaging and testing capabilities, these new lines of 3D NAND based SSDs including M.2, mSata, SlimSata, 2.5” SSD, eUSB and memory cards, provides a new level of product differentiation targeting the industrial and embedded markets. ATP will showcase these new solutions and related products at the Flash Memory Summit 2016 from August 9 to 11, at the Santa Clara Convention Center, meeting room #205.
  • 2016-03-28 ATP Furthers Support of Micron Legacy DRAM Modules
    Continues to manufacture SDR/DDR1 Modules on Micron EOL List
  • 2016-02-15 ATP highlights Its Automotive Solutions at the EW2016
    In addition to introducing latest SATA III Product Family

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